Because I got meanwhile the impression that my Ultrasonic Cleaner damages Crystals for Realtime Clocks (31.xxx kHz Crystals) because of possibly too close frequency, I want to ask before damaging the freshly soldered BC660K-GL …
I use Vapor Phase Reflow Soldering (GALDEN 238°C) for reflow-soldering all PCBs.
To remove flux residue, I want to put the assembled PCB into my Ultrasonic Cleaner. PCB will be submerged into a very concentrated PCB cleaner (alcalic liquid) and then Ultrasonic Vibrations of 50 W will be applied 5 minutes long.
Are there any concerns in doing that with a mounted BC660K-GL module?
This module has a RF shielding cover. It would be really bad if this shield is not perfectly sealed along its edge and some cleaning liquid gets into the module.
Please let me know.