Hello,
I am starting the layout for the LC86GPAMD and, although I do not have much space, I believe I will be able to maintain the recommended 30 x 30 mm clear area around it.
I have tried to find an existing layout design for this family of modules, but I have not found anything sufficiently clear. I already have all the PDFs from your website, including quectel_lc86g_series_hardware_design_v1.5 , but the detailed layout recommendations are still not completely clear to me.
Do you have any other guide or example or images of layouts that you could provide? Ideally something showing details such as:
- where you place the supply capacitors,
- whether GND pads are better connected with direct connection or thermal relief / spoke,
- and any other practical layout recommendations.
Also, the keep-out area is suggested as at least 2.5 mm radius . Would it be better if I make it larger, or does it no longer make much difference beyond 2.5 mm? And is that keep-out area supposed to be a complete void/no-copper area?
Thank you very much.
Best regards,