Hi,
Thanks for your query in Quectel forums.
If there is no copper on the PCB, the effect of adding a heat dissipation pad between the PCB and the module will be worse, but it also has a heat dissipation effect. Adding a heat dissipation pad on the shield cover is the same.
Document [5] The specific file name of the document is introduced on page 70 of the document, as shown in the figure:
I will also send you this document.
thanks.Quectel_LTE_Module_Thermal_Design_Guide_V1.0.pdf (1.7 MB)
1 Like