BC660K-GL USIM ESD Protection for eSIM (MFF2) Needed?

IoT Modules LPWA Module
1

Per the hardware design datasheet, it is recommended to place comments next to the USIM connector to enhance ESD protection:

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To offer good ESD protection, it is recommended to add a TVS diode array whose parasitic
capacitance should be not more than 50 pF. Place the ESD protection device as close to the USIM
card connector as possible, and ensure the USIM card signal lines from the USIM card connector go
through the ESD protection device before reaching the module. The 22 Ω resistors should be
connected in series between the module and the USIM card connector to suppress EMI spurious
transmission and enhance ESD protection. Note that the module’s USIM peripheral devices should
be placed close to the USIM card connector.

Are these additional components for ESD protection required if the application utilize an embedded sim (eSIM MFF2) form factor? This form factor has no connector, but rather a soldered down IC. There is limited to no risk of introduce static electricity as the user cannot actually physically insert a SIM card.

Thanks!
Mike

2

Using ESIM eliminates the need to add ESD devices，Thanks!

3

ESD protection is a good idea for all EXPOSED pads, which can someone touch. Soldered MFF2 chip is not such an exposure. :wink:

4

Thanks, I figured as such but wanted to confirm because this would deviate a small amount from the reference design in the hardware guide.